Views: 202 Author: zhongle Publish Time: 2023-07-20 Origin: Site
After the operation of the diamond grinding wheel with low grinding force and speed, the surface of the diamond abrasive is scattered with many edges reflecting the diamond abrasive's small wear plane. This is because mechanical wear caused by a mechanical conflict between diamond abrasive particles and superhard data occurs gradually, and abrasive particle wear is directly proportional to grinding stroke length.
According to diamond properties, the degree of graphitization is related to the crystal orientation and is dependent on the crystal integrity of diamond abrasives. Diamond abrasives with high crystal integrity exhibit low graphitization loss.
Some of the diamond abrasive grains on the diamond grinding wheel break and crack, resulting in the whole grain falling off. Crystal cleavage, which is defined as a plane rupture brought on by the type, distribution, and chemical bond of crystal structure element 7, frequently takes place along the directional plane at the end of the strength of the chemical bond.
The irregular grinding process causes the abrasive to rise to a high temperature instantly, cool quickly under the influence of the grinding fluid, and repeat the process numerous times. This creates a significant amount of thermal stress on the abrasive's surface, which causes the surface to crack, as well as fracture wear, defect distribution, and oxidation of the diamond abrasive. Due to the proximity of graphitization, thermal stress first develops at the abrasive crystal's surface flaws, leading to multiple cracks that propagate under the influence of grinding force. As a result, some of the weakest strength of the crushing and falling abrasive is a result of the interaction between grinding force and grinding heat.
The surface quality and processing power of superhard data grinding is directly impacted by the choice of abrasive particle size for a diamond grinding wheel. To increase processing power, the coarser particle size should be chosen whenever possible under the assumption that the processing quality requirements can be met. For coarse grinding, abrasives with a particle size of 120 to 150#, abrasives with a particle size of 180 to 240#, and micro-powder abrasives with a particle size of W40 to W7 can all be used.
The grinding wheel loss cost addition test results show that in coarse grinding, a higher concentration can be chosen to add the number of useful abrasive particles per unit area, and in improving the processing power + fine grinding, a lower concentration should be selected. The concentration of abrasive in a diamond grinding wheel has a certain influence on the grinding effect of superhard data. Under typical circumstances, the abrasive concentration can be set to 100–150% for coarse grinding and 75–100% for fine grinding.
Diamond abrasives with intact crystal shapes and a relatively high grinding ratio are suitable for metal bonds with excellent thermal conductivity, such as those found in bronze grinding wheels, which have a stronger binding force on abrasive grains. Due to its poor adhesion to abrasive particles, the resin bond is suitable for diamond abrasives with high brittleness and low strength. The ceramic bond serves a purpose between the aforementioned two. Cast iron short fiber bonds have a binding force of 50–100 kg/mm2 and a tensile strength of 15–30 kg/mm2, which is significantly higher than the function of common metal bonds. The diamond grinding wheel has a grinding ratio that is roughly 4-5 times greater than the resin bond grinding wheel, making it ideal for the production of diamond grinding wheels with unbroken crystal shapes.
Mechanical conflict wear primarily affects diamond abrasive particles when low grinding force and speed are present. The diamond particles oxidize and graphitize when the temperature in the grinding zone is high. The combined effect of grinding force and grinding heat causes the cleavage and crushing of abrasive particles. The whole grains fall off when the mechanical force acting on the grinding grains is greater than the force holding the grinding wheel bond together.
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